
A | 8月24日消息,美光HBM设计架构研究员拉古·斯里拉马内尼在8月23日斯坦福大学举办的Hot Chips 2026半导体会议上警告,内存墙依然存在,且情况还在恶化。
所谓内存墙,是指GPU速度不断提升,但存储数据的高带宽内存却无法跟上其速度而导致的瓶颈。 会议展示的最新HBM封装技术上,两颗GPU与八颗12层HBM4集成于一体,其中约90%半导体面积都用于存储,存储面积是GPU的8倍多。 London, Oct 22 (UNI) Former UK Prime Minister Boris Johnson has arrived in the United Kingdom amid speculation that he might attempt to vie for Conservative leadership and second term at Downing Street after the resignation of Liz Truss, British media reported on Saturday.
On Friday, James Duddridge, a member of parliament and Johnson's ally, said that the ex-prime minister told him he was "up for it" and that he would return early from his vacation in the Caribbean given the political vacuum following Truss' resignation.
The plane with Johnson on board landed at London Gatwick airport on Saturday morning, Sky News reported.
Johnson became prime minister in July 2019 and stepped down in September 2022 on the back of multiple scandals over parties at his office during COVID-19 lockdowns. He was succeeded by Liz Truss, who survived only 44 days before resigning on October 20 after a series of controversial economic policy decisions.
Truss became the shortest-serving prime minister in UK history. She will remain in office until her successor is elected. Johnson and former UK finance minister Rishi Sunak are considered two top contenders of the Conservative Party leadership and subsequent prime minister's role. The vote is scheduled for October 27.
UNI/SPUTNIK GNK。芯片内部空间几乎全被存储占据,这正是用面积换带宽所付出的代价,也是内存墙问题日益严峻的直观体现。
拉古指出,AI加速器计算性能以每两年3倍速度发展,但同期HBM发展速度不到每两年2倍。这解释了高带宽内存为何还是喂不饱GPU,无论计算设备速度多快,数据通道狭窄终将因供给过慢而停滞。 硬件上,当前HBM制造相同存储容量消耗的晶圆数量约为普通DDR5的3倍。

B | 拉古强调,技术升级越快芯片尺寸越大、堆叠层数越多,这一差距还在扩大,内存行业将持续面临短缺。 散热方面,HBM是多层堆叠结构,底层产生的热量最多,但热量必须穿透所有堆叠层才能到达顶部的冷却系统,这使得散热效率大打折扣,液冷和芯片超薄技术正提供解决方案。

C | 拉古表示,HBM的挑战需要内存厂商、GPU设计商、代工厂和封装厂商共同协作才能解决。

D |

E |
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